Technical Specifications of 558-10-500M30-001101
| Datasheet |  558-10-500M30-001101 datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Preci-Dip |
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| Series | 558 |
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| Packaging | Bulk |
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| Type | PGA |
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| Number of Positions or Pins (Grid) | 500 (30 x 30) |
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| Pitch - Mating | 0.050" (1.27mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 10μin (0.25μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame |
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| Termination | Solder |
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| Pitch - Post | 0.050" (1.27mm) |
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| Contact Finish - Post | Gold |
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| Contact Finish Thickness - Post | 10μin (0.25μm) |
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| Contact Material - Post | Brass |
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| Housing Material | FR4 Epoxy Glass |
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| Operating Temperature | -55°C ~ 125°C |
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| Termination Post Length | 0.111" (2.83mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | 10 mOhm |
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