Technical Specifications of 2100-7243-00-1807
Category | Connectors, Interconnects |
Family | Sockets for ICs, Transistors |
Manufacturer | 3M |
Series | OEM |
Packaging | Bulk |
Type | QFP |
Number of Positions or Pins (Grid) | 100 (4 x 25) |
Pitch - Mating | - |
Contact Finish - Mating | Tin-Lead |
Contact Finish Thickness - Mating | 200μin (5.08μm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | - |
Contact Finish - Post | Tin-Lead |
Contact Finish Thickness - Post | 200μin (5.08μm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyethersulfone (PES), Glass Filled |
Operating Temperature | 0°C ~ 105°C |
Termination Post Length | 0.020" (0.50mm) |
Material Flammability Rating | UL94 V-0 |
Current Rating | 1A |
Contact Resistance | 25 mOhm |
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