Technical Specifications of 514-83-560M33-001148
| Datasheet |  514-83-560M33-001148 datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Preci-Dip |
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| Series | 514 |
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| Packaging | Bulk |
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| Type | BGA |
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| Number of Positions or Pins (Grid) | 560 (33 x 33) |
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| Pitch - Mating | 0.100" (2.54mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 29.5μin (0.75μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Surface Mount |
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| Features | Open Frame |
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| Termination | Solder |
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| Pitch - Post | 0.100" (2.54mm) |
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| Contact Finish - Post | Tin |
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| Contact Finish Thickness - Post | - |
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| Contact Material - Post | Brass |
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| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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| Operating Temperature | -55°C ~ 125°C |
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| Termination Post Length | 0.055" (1.40mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | 10 mOhm |
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