Technical Specifications of 517-83-370-19-121111
| Datasheet |  517-83-370-19-121111 datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Preci-Dip |
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| Series | 517 |
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| Packaging | Bulk |
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| Type | PGA |
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| Number of Positions or Pins (Grid) | 370 (19 x 19) |
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| Pitch - Mating | 0.050" (1.27mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 29.5μin (0.75μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Open Frame |
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| Termination | Solder |
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| Pitch - Post | 0.050" (1.27mm) |
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| Contact Finish - Post | Tin |
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| Contact Finish Thickness - Post | - |
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| Contact Material - Post | Brass |
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| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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| Operating Temperature | -55°C ~ 125°C |
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| Termination Post Length | 0.125" (3.18mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | 10 mOhm |
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