Technical Specifications of HF115AC-0.0055-AC-105
| Datasheet |  HF115AC-0.0055-AC-105 datasheet |
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| Category | Fans, Thermal Management |
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| Family | Thermal - Pads, Sheets |
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| Manufacturer | Bergquist |
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| Series | Hi-Flow? 115-AC |
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| Part Status | Active |
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| Usage | SIP |
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| Shape | Rectangle |
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| Outline | 36.83mm x 21.29mm |
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| Thickness | 0.0055" (0.140mm) |
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| Material | Phase Change Compound |
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| Adhesive | Adhesive - One Side |
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| Backing, Carrier | Fiberglass |
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| Color | Gray |
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| Thermal Resistivity | 0.35°C/W |
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| Thermal Conductivity | 0.8 W/m-K |
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