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Home > Brand Introduction: STATS ChipPAC, Ltd

Brand Introduction: STATS ChipPAC, Ltd

Last Updated on May 27,2025 by Kevin Chen

STATS.jpg

STATS ChipPAC, Ltd., headquartered in Singapore, is a global leader in semiconductor packaging, testing, and design services. Operating as part of China’s JCET Group since its acquisition in 2015, the company stands among the world’s top Outsourced Semiconductor Assembly and Test (OSAT) providers, delivering advanced solutions to industries such as automotive, communications, consumer electronics, and computing.

History and Evolution
Formed in 2004 through the merger of STATS (Singapore Technologies Assembly & Test Services) and ChipPAC, STATS ChipPAC combined decades of expertise in semiconductor back-end processes. The 2015 integration with JCET Group bolstered its global reach, technological capabilities, and market share, positioning it as a key player in the $30 billion OSAT industry.

Core Services and Technologies
The company specializes in cutting-edge packaging and testing solutions, including flip-chip, wafer-level packaging (WLP), system-in-package (SiP), and 2.5D/3D integration. These technologies enhance performance, power efficiency, and miniaturization for applications like 5G, AI, and IoT. STATS ChipPAC also offers turnkey services spanning design support, wafer probing, assembly, and final test, ensuring quality and reliability for high-growth markets.

Global Presence and Quality Standards
With a network of manufacturing and R&D facilities across Singapore, South Korea, China, Taiwan, and the United States, STATS ChipPAC serves clients worldwide. The company adheres to stringent certifications, including ISO 9001 and IATF 16949, underscoring its commitment to automotive-grade quality and reliability.

Market Position and Innovation
As part of JCET, STATS ChipPAC leverages synergies in R&D and production scalability, catering to top fabless firms, IDMs, and OEMs. Its focus on innovation is evident in its 3,000+ patent portfolio and collaborations on emerging technologies like heterogeneous integration and advanced substrates.

Sustainability and Future Outlook
Committed to sustainable practices, STATS ChipPAC emphasizes energy-efficient manufacturing and eco-friendly materials. With the semiconductor industry poised for growth driven by AI and electric vehicles, the company remains pivotal in enabling next-generation electronics through scalable, reliable solutions.

STATS ChipPAC’s blend of technological expertise, global infrastructure, and customer-centric approach solidifies its role as a critical enabler of the modern digital economy.


Author
Kevin Chen
Founder / Writer at Rantle East Electronic Trading Co.,Limited
I am Kevin Chen, I graduated from University of Electronic Science and Technology of China in 2000. I am an electrical and electronic engineer with 23 years of experience, in charge of writting content for ICRFQ. I am willing use my experiences to create reliable and necessary electronic information to help our readers. We welcome readers to engage with us on various topics related to electronics such as IC chips, Diode, Transistor, Module, Relay, opticalcoupler, Connectors etc. Please feel free to share your thoughts and questions on these subjects with us. We look forward to hearing from you!
Home > Brand Introduction: STATS ChipPAC, Ltd

Brand Introduction: STATS ChipPAC, Ltd

STATS.jpg

STATS ChipPAC, Ltd., headquartered in Singapore, is a global leader in semiconductor packaging, testing, and design services. Operating as part of China’s JCET Group since its acquisition in 2015, the company stands among the world’s top Outsourced Semiconductor Assembly and Test (OSAT) providers, delivering advanced solutions to industries such as automotive, communications, consumer electronics, and computing.

History and Evolution
Formed in 2004 through the merger of STATS (Singapore Technologies Assembly & Test Services) and ChipPAC, STATS ChipPAC combined decades of expertise in semiconductor back-end processes. The 2015 integration with JCET Group bolstered its global reach, technological capabilities, and market share, positioning it as a key player in the $30 billion OSAT industry.

Core Services and Technologies
The company specializes in cutting-edge packaging and testing solutions, including flip-chip, wafer-level packaging (WLP), system-in-package (SiP), and 2.5D/3D integration. These technologies enhance performance, power efficiency, and miniaturization for applications like 5G, AI, and IoT. STATS ChipPAC also offers turnkey services spanning design support, wafer probing, assembly, and final test, ensuring quality and reliability for high-growth markets.

Global Presence and Quality Standards
With a network of manufacturing and R&D facilities across Singapore, South Korea, China, Taiwan, and the United States, STATS ChipPAC serves clients worldwide. The company adheres to stringent certifications, including ISO 9001 and IATF 16949, underscoring its commitment to automotive-grade quality and reliability.

Market Position and Innovation
As part of JCET, STATS ChipPAC leverages synergies in R&D and production scalability, catering to top fabless firms, IDMs, and OEMs. Its focus on innovation is evident in its 3,000+ patent portfolio and collaborations on emerging technologies like heterogeneous integration and advanced substrates.

Sustainability and Future Outlook
Committed to sustainable practices, STATS ChipPAC emphasizes energy-efficient manufacturing and eco-friendly materials. With the semiconductor industry poised for growth driven by AI and electric vehicles, the company remains pivotal in enabling next-generation electronics through scalable, reliable solutions.

STATS ChipPAC’s blend of technological expertise, global infrastructure, and customer-centric approach solidifies its role as a critical enabler of the modern digital economy.