Technical Specifications of H602008000J0G
| Datasheet |  H602008000J0G datasheet |
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| Category | Connectors, Interconnects |
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| Family | Terminal Blocks - Wire to Board |
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| Manufacturer | Amphenol FCI |
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| Series | H6 |
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| Packaging | Bulk |
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| Number of Levels | 1 |
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| Positions Per Level | 2 |
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| Pitch | 0.197" (5.00mm) |
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| Mating Orientation | Horizontal with Board |
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| Current | 11A |
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| Voltage | 300V |
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| Wire Gauge | 12-20 AWG |
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| Mounting Type | Through Hole |
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| Wire Termination | Screwless - Push Button Clamp |
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| Features | - |
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| Color | Gray |
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| Operating Temperature | -40°C ~ 115°C |
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| Housing Material | Thermoplastic |
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| Contact Material - Plating | Brass - Tin Plated |
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| Clamp Material - Plating | Steel, Stainless |
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| Screw Material - Plating | - |
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| Torque - Screw | - |
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| Screw Thread | - |
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