Technical Specifications of 239-5605-02-0602
Datasheet | 239-5605-02-0602 datasheet |
Category | Connectors, Interconnects |
Family | Sockets for ICs, Transistors |
Manufacturer | 3M |
Series | - |
Packaging | Bulk |
Type | Zig-Zag |
Number of Positions or Pins (Grid) | 39 (1 x 19, 1 x 20) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30μin (0.76μm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 30μin (0.76μm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polysulfone (PSU), Glass Filled |
Operating Temperature | -55°C ~ 150°C |
Termination Post Length | 0.100" (2.54mm) |
Material Flammability Rating | UL94 V-0 |
Current Rating | 1A |
Contact Resistance | 25 mOhm |
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