Technical Specifications of 100-008-001
| Datasheet |  100-008-001 datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | 3M |
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| Series | 100 |
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| Packaging | Bulk |
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| Type | DIP, 0.3" (7.62mm) Row Spacing |
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| Number of Positions or Pins (Grid) | 8 (2 x 4) |
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| Pitch - Mating | 0.100" (2.54mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 8μin (0.20μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame, Seal Tape |
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| Termination | Solder |
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| Pitch - Post | 0.100" (2.54mm) |
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| Contact Finish - Post | Gold |
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| Contact Finish Thickness - Post | Flash |
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| Contact Material - Post | Brass |
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| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
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| Operating Temperature | -65°C ~ 125°C |
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| Termination Post Length | 0.126" (3.20mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | - |
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