Technical Specifications of 228-7474-55-1902
| Datasheet |  228-7474-55-1902 datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | 3M |
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| Series | Textool? |
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| Packaging | Bulk |
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| Type | SOIC |
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| Number of Positions or Pins (Grid) | 28 (2 x 14) |
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| Pitch - Mating | - |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | - |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame |
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| Termination | Solder |
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| Pitch - Post | - |
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| Contact Finish - Post | Gold |
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| Contact Finish Thickness - Post | 30μin (0.76μm) |
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| Contact Material - Post | Beryllium Copper |
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| Housing Material | Polyethersulfone (PES), Glass Filled |
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| Operating Temperature | -55°C ~ 150°C |
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| Termination Post Length | 0.140" (3.56mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | - |
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