Technical Specifications of 40-6553-18
| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Aries Electronics |
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| Series | 55 |
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| Packaging | Bulk |
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| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
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| Number of Positions or Pins (Grid) | 42 (2 x 21) |
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| Pitch - Mating | 0.100" (2.54mm) |
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| Contact Finish - Mating | Tin |
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| Contact Finish Thickness - Mating | 200μin (5.08μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame |
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| Termination | Solder |
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| Pitch - Post | 0.100" (2.54mm) |
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| Contact Finish - Post | Tin |
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| Contact Finish Thickness - Post | 200μin (5.08μm) |
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| Contact Material - Post | Beryllium Copper |
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| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
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| Operating Temperature | - |
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| Termination Post Length | 0.110" (2.78mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | - |
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