Technical Specifications of SIP1X08-011BLF
| Datasheet |  SIP1X08-011BLF datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Amphenol FCI |
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| Series | SIP1x |
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| Packaging | Bulk |
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| Type | SIP |
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| Number of Positions or Pins (Grid) | 8 (1 x 8) |
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| Pitch - Mating | 0.100" (2.54mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 10μin (0.25μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame |
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| Termination | Solder |
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| Pitch - Post | 0.100" (2.54mm) |
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| Contact Finish - Post | Tin |
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| Contact Finish Thickness - Post | 200μin (5.08μm) |
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| Contact Material - Post | Brass |
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| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
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| Operating Temperature | - |
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| Termination Post Length | 0.125" (3.18mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | - |
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| Contact Resistance | - |
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