Technical Specifications of 18-8670-610C
| Datasheet |  18-8670-610C datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Aries Electronics |
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| Series | 8 |
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| Packaging | Bulk |
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| Type | DIP, 0.6" (15.24mm) Row Spacing |
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| Number of Positions or Pins (Grid) | 18 (2 x 9) |
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| Pitch - Mating | 0.100" (2.54mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 30μin (0.76μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame, Elevated |
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| Termination | Solder |
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| Pitch - Post | 0.100" (2.54mm) |
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| Contact Finish - Post | Gold |
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| Contact Finish Thickness - Post | 10μin (0.25μm) |
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| Contact Material - Post | Brass |
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| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
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| Operating Temperature | -55°C ~ 105°C |
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| Termination Post Length | 0.140" (3.56mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 3A |
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| Contact Resistance | - |
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