Technical Specifications of BP100-0.008-00-1010
| Datasheet |  BP100-0.008-00-1010 datasheet |
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| Category | Fans, Thermal Management |
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| Family | Thermal - Pads, Sheets |
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| Manufacturer | Bergquist |
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| Series | Bond-Ply? 100 |
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| Part Status | Active |
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| Usage | Sheet |
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| Shape | Square |
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| Outline | 254.00mm x 254.00mm |
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| Thickness | 0.008" (0.203mm) |
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| Material | Polyimide |
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| Adhesive | Adhesive - Both Sides |
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| Backing, Carrier | Fiberglass |
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| Color | White |
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| Thermal Resistivity | 0.78°C/W |
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| Thermal Conductivity | 0.8 W/m-K |
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