Technical Specifications of ZL88702LDG1
| Datasheet |  ZL88702LDG1 datasheet |
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| Category | Integrated Circuits (ICs) |
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| Family | Interface - Telecom |
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| Manufacturer | Microsemi Corporation |
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| Series | - |
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| Packaging | Tray |
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| Part Status | Active |
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| Function | Telecom Circuit |
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| Interface | PCM |
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| Number of Circuits | 1 |
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| Voltage - Supply | 3.135 V ~ 3.465 V |
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| Current - Supply | - |
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| Power (Watts) | - |
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| Operating Temperature | -40°C ~ 85°C |
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| Mounting Type | Surface Mount |
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| Package / Case | 64-VFQFN Exposed Pad |
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| Supplier Device Package | 64-QFN (9x9) |
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| Includes | - |
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