Technical Specifications of UPD70F3757GJ-GAE-AX
| Datasheet |  UPD70F3757GJ-GAE-AX datasheet |
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| Category | Integrated Circuits (ICs) |
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| Family | Embedded - Microcontrollers |
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| Manufacturer | Renesas Electronics America |
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| Series | V850ES/Hx3 |
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| Packaging | Tray |
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| Part Status | Active |
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| Core Processor | V850ES |
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| Core Size | 32-Bit |
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| Speed | 32MHz |
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| Connectivity | CSI, EBI/EMI, I2C, UART/USART |
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| Peripherals | DMA, LVD, PWM, WDT |
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| Number of I/O | 128 |
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| Program Memory Size | 512KB (512K x 8) |
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| Program Memory Type | FLASH |
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| EEPROM Size | - |
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| RAM Size | 32K x 8 |
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| Voltage - Supply (Vcc/Vdd) | 3.7 V ~ 5.5 V |
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| Data Converters | A/D 24x10b |
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| Oscillator Type | Internal |
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| Operating Temperature | -40°C ~ 85°C (TA) |
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| Package / Case | 144-LQFP |
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| Supplier Device Package | * |
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