Technical Specifications of SMD291SNL250T3
| Datasheet |  SMD291SNL250T3 datasheet |
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| Category | Soldering, Desoldering, Rework Products |
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| Family | Solder |
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| Manufacturer | Chip Quik Inc. |
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| Series | CHIPQUIK? |
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| Part Status | Active |
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| Process | Lead Free |
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| Type | Solder Paste |
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| Flux Type | No-Clean |
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| Composition | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) |
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| Wire Gauge | - |
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| Diameter | - |
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| Core Size | - |
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| Form | Jar, 250g (9 oz) |
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| Melting Point | 422 ~ 428°F (217 ~ 220°C) |
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| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
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