Technical Specifications of XR2C-2011-N
| Datasheet |  XR2C-2011-N datasheet |
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| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | Omron Electronics Inc-EMC Div |
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| Series | XR2 |
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| Packaging | Bulk |
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| Type | SIP |
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| Number of Positions or Pins (Grid) | 20 (1 x 20) |
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| Pitch - Mating | 0.100" (2.54mm) |
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| Contact Finish - Mating | Gold |
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| Contact Finish Thickness - Mating | 10μin (0.25μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Closed Frame |
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| Termination | Solder |
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| Pitch - Post | 0.100" (2.54mm) |
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| Contact Finish - Post | Gold |
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| Contact Finish Thickness - Post | 10μin (0.25μm) |
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| Contact Material - Post | Beryllium Copper |
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| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
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| Operating Temperature | -55°C ~ 125°C |
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| Termination Post Length | 0.126" (3.20mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | 20 mOhm |
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