Technical Specifications of 2100-7243-00-1807
| Category | Connectors, Interconnects |
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| Family | Sockets for ICs, Transistors |
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| Manufacturer | 3M |
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| Series | OEM |
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| Packaging | Bulk |
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| Type | QFP |
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| Number of Positions or Pins (Grid) | 100 (4 x 25) |
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| Pitch - Mating | - |
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| Contact Finish - Mating | Tin-Lead |
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| Contact Finish Thickness - Mating | 200μin (5.08μm) |
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| Contact Material - Mating | Beryllium Copper |
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| Mounting Type | Through Hole |
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| Features | Open Frame |
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| Termination | Solder |
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| Pitch - Post | - |
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| Contact Finish - Post | Tin-Lead |
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| Contact Finish Thickness - Post | 200μin (5.08μm) |
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| Contact Material - Post | Beryllium Copper |
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| Housing Material | Polyethersulfone (PES), Glass Filled |
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| Operating Temperature | 0°C ~ 105°C |
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| Termination Post Length | 0.020" (0.50mm) |
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| Material Flammability Rating | UL94 V-0 |
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| Current Rating | 1A |
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| Contact Resistance | 25 mOhm |
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